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Louis Hsieh, Director of Operations Support at UMC, said: "Dow's electronic materials have won this award for their consistent performance in terms of quality, price, delivery, service and technology. Dow is an outstanding player in our pursuit of success. Partners, they have the ability to innovate and are able to meet our strict technical requirements for advanced nodes in the development cycle of the chemical mechanical grinding, which is critical for our advanced products. UMC is pleased to be a partner for Dow Electronic Materials, and We expect our cooperation in 2010 and beyond to be successful."
Austin Chen, general manager of Dow Electronic Materials Greater China and Southeast Asia, said: “We are very honored to receive this honor. As an important supplier of chemical mechanical grinding consumables, we have been committed to maintaining a high standard of quality and customers. Satisfaction, our ability to win this award is inseparable from our ability to maintain a close supply-and-demand partnership, and we can get this award from such a valuable customer as UMC, for all of us and for us and UMC. The recognition of partnership input."
The Outstanding Supplier Awards Ceremony was held together with the 30th Anniversary Ceremony of UMC. The launch ceremony for the 3rd and 4th phase of Fab 12A plant in Tainan Science Park was also held.
Dow Electronic Materials Receives Outstanding Supplier Award from UMC
Dow Electronic Materials, a leader and innovator of chemical mechanical polishing (CMP) technology for the global semiconductor industry, today announced that its semiconductor technology business received UMC's 2009 Outstanding Supplier Award . Dow Electronic Materials stood out from more than 100 suppliers and received the highest award for outstanding suppliers in the UMC chemical mechanical polishing pad consumables category.